RAM News - Page 1
SK hynix develops the world's first 16Gb DDR5 memory chip using its new 1c node
SK hynix has announced it has developed the industry's first 1c DDR5, with mass production expected this year for volume shipment in 2025.
SK hynix announced the industry's first 16Gb DDR5 built using its 1c node, the sixth generation of its 10nm process. The company says that the success of this marks the beginning of the extreme scaling to the level closer to 10nm in the memory process technology.
The company continues: "the degree of difficulty to advance the shrinking process of the 10nm-range DRAM technology has grown over generations, but SK hynix has become the first in the industry to overcome the technological limitations by raising the level of completion in design, thanks to its industry-leading technology of the 1b, the fifth generation of the 10nm process".
COLORFUL adds stylish 'Loong Edition' DDR5 Memory to its iGame Year of the Dragon line-up
The new Colorful iGame DDR5 Loong Edition memory was created to celebrate the Year of the Dragon. It presents a stylish take on the popular all-white hardware look. The design also complements the company's Loong Edition GeForce RTX 40 Series GPUs and Z790 motherboards, which were announced earlier this year.
The DDR modules feature a layered RGB light bar on top of a tall aluminum alloy heatsink adorned with traditional Chinese decorative patterns "Xiangyun" (auspicious clouds) and "Yufeng" (gentle breeze). The taller body and heatsink design was chosen for thermal and heat dissipation and to highlight the limited edition design.
Hardware-wise, these DDR5 modules sport high-performance Hynix A-die chips, which Colorful says are great for overclocking. The PMIC components are covered with "thermal silica gel" to enhance cooling. Available in 32GB (2 x 16GB) and 48GB (2 x 48GB) kits, with speeds of up to 7200 MT/s, here's a closer look at the options.
MSI talks CAMM2 DDR5 memory benefits for the desktop PC: higher speeds, lower latencies, more
CAMM2 memory modules are on their way, and will debut inside of desktop PCs in the near future, with MSI highlighting some of the benefits of CAMM2 memory. Check out their video below:
JEDEC has already made the new CAMM2 standard official, with CAMM2 memory modules for desktops marking a HUGE shift from traditional SO-DIMM memory that we've seen previously. CAMM2 was designed to save space on mobile platforms like laptops and smartphones, but the PC industry sees the huge potential of CAMM2 beyond just laptops and smartphones.
MSI, ASUS, and ASRock have teased their first motherboards with CAMM2 support, and now MSI went into much more detail about CAMM2 memory modules during their recent Insider Livestream. MSI points out that unlike SO-DIMM memory which has SI (System Interface) stubs embedded within the PCB of the motherboard which reduces the platform capabilities for bus speed, CAMM2's interface is connected directly to the CAMM2 module. Both the inner and outer connections of the IMC are connected to CAMM2 modules, which provide a path to higher signal integrity, and higher performance.
SK hynix preparing to expand DRAM capacity (HBM, DRAM) by 80K wafers per month at M16, M10 fabs
SK hynix has started ordering equipment for DRAM expansion investment, with production capacity expected to be expanded by 18% at its M16, and M10 facilities in South Korea.
The South Korean memory giant has started placing "full-scale orders" for production facilities at its M16 plant in Icheon, South Korea, which is currently under construction as a new state-of-the-art DRAM plant. Chosun reports from its industry sources that SK hynix ordered the key equipment to be invested at its M16 expansion from major equipment manufacturers.
Market research firm Omdia reports that SK hynix's monthly average DRAM production increased from 380,000 units in Q4 2023 to 400,000 units in Q2 2024. SK hynix is expected to increase its production capacity to 440,000 units in Q3 2024, but still trails behind South Korean memory rival Samsung, which produces a monthly average of over 670,000 units.
KLEVV unveils CRAS V RGB ROG Certified DDR5-7200 RAM with Intel XMP, AMD EXPO profiles
KLEVV has just introduced its latest flagship CRAS V RGB ROG Certified DDR5 OC Gaming RAM, with the new kits available at one fast speed: DDR5-7200 spec.
The new KLEVV CRAS V RGB ROG Certified DDR5 OC Gaming RAM comes in 32GB kits (16GB x 2), and 48GB kits (24GB x 2) with built-in Intel XMP 3.0 and AMD EXPO profile support, meaning you don't need to swap memory for each system to get full compatibility.
KLEVV claims that when paired with an ASUS ROG motherboard, the new CRAS V RGB ROG Certified DDR5 OC Gaming RAM will support speeds of up to DDR5-7400. The new kits might be ROG Certified, but they'll work in other motherboards, just as regular CRAS V RGB memory modules.
SK hynix tells customers it will raise DDR5 DRAM prices by 15-20%, Samsung, Micron to follow
SK hynix has just announced its clients that it will be raising DDR5 DRAM prices by 15-20%, something that DRAM rivals Samsung and Micron are 'likely to follow'.
Why? Because of AI, that's why. More specifically, HBM... and the insatiable AI GPU demand is driving unbelievable demand for HBM which is seeing DRAM manufacturers SK hynix, Samsung, and Micron, all pushing everything they can into HBM production capacity.
In a new report from UDN, we're learning that the supply chain has received a notification from SK hynix that it will be increasing its DDR5 pricing by 15-20%. SK hynix is the second-largest DRAM manufacturer, second to South Korean rival Samsung. Over in Taiwan, local factories including Nanya have started mass production of DDR5, just in time for the price increases, and will benefit first from the higher-priced DDR5 memory. ADATA and TEAMGROUP are also expected ot benefit from the low-price inventory, reports UDN.
G.SKILL's new ultra-low latency DDR5-6000 memory kits for AMD AM5 are the shiny Royal Neo kind
G.SKILL has announced some new DDR5 memory for AMD AM5 platforms, just in time for the arrival of Zen 5 and the new Ryzen 9000 Series of CPUs. These fall under the shiny and sparkly Trident Z5 Royal Neo series and feature "ultra-low latency specifications" and the speed of DDR5-6000.
These new Trident Z5 Royal Neo series kits arrive in DDR5-6000 CL28-36-36-96 and DDR5-6000 CL28-38-38-96 kits, with capacities of 32GB (2x16GB) and 64GB (2x32GB) for the former and 48GB (2x24GB) and 96GB (2x48GB) for the latter. As expected, they support AMD EXPO technology for overclocking, with G.SKILL describing low timing as an "ideal DDR5 memory solution for enthusiasts and overclockers."
This announcement follows from the new Trident Z5 Royal Neo DDR5-8000 memory for AMD AM5 platforms we reported on last week; however, the "ultra-low latency specifications" make these new kits stand out. The lower the CL number, the better.
Micron begins shipping its ninth-generation (G9) NAND flash, inside Micron's 2650 NVMe SSD
Micron has just announced it is shipping ninth-generation (G9) TLC NAND in SSDs, which marks an industry first with this milestone.
The new Micron G9 NAND features the industry's highest transfer speed of 3.6GB/sec, which the company says delivers "unsurpassed bandwidth for reading and writing data". The new G9 NAND enables best-in-class performance for AI and other data-intensive workloads, from personal devices and edge servers to enterprise and cloud data centers.
Scott DeBoer, executive vice president of Technology and Products at Micron, explains: "The shipment of Micron G9 NAND is a testament to Micron's prowess in process technology and design innovations. Micron G9 NAND is up to 73% denser than competitive technologies in the market today, allowing for more compact and efficient storage solutions that benefit both consumers and businesses".
G.SKILL announced Trident Z5 Royal Neo DDR5-8000 memory for Zen 5 and AMD AM5
There's nothing fancier or flashier than G.SKILL's Trident Z5 Royal memory, a "luxury-class" design that includes a CNC-cut aluminum heatspreader with a gold or silver mirror finish and a crystalline light bar with what looks like RGB diamonds.
This week, G.SKILL has announced the brand-new Trident Z5 Royal Neo memory designed for AMD AM5 platforms and the upcoming Zen 5-based Ryzen 9000 Series of desktop CPUs.
With support for AMD EXPO technology and the expanded DDR5 support arriving for AM5, G.SKILL Trident Z5 Royal Neo Series DDR5 Memory supports up to DDR5-8000 speeds. Available in 32GB (2x16GB) and 48GB (2x24GB) kit capacities, the Trident Z5 Royal Neo Series's "extreme speed memory specification" is DDR5-8000 with low-latency CL38-48-48-127 timings.
RISC-V systems support replacing RAM sticks WITHOUT powering off the system
The upcoming version 6.11 of the mainline Linux kernel has support for RISC-V memory hot plugging, meaning you can pull RAM sticks out of your PC without turning it off... very nice.
The Linux kernel already supported this RAM hot-swappable feature for other CPU architectures, but for the long-term health of the open-architecture RISC-V processors, this is a good step in the right direction. We're used to hot-plugging and hot-swapping HDDs and SSDs out of systems, but hot-plugging RAM is magical.
Memory hot-plugging is also something that's not new; as Tom's Hardware reports, it was available on the ultra-retro Zilog Z80 CPUs that were released all the way back in the 1980s. Fast-forward to today, and RAM hot-swapping is usually something reserved for server motherboards with dedicated server versions of Windows and most Linux distributions.